微量合金元素对Cu-Ni-Si合金组织和性能的影响
Effect of Trace Element on Microstructure and Properties of Cu-Ni-Si Alloy
张 毅1, 刘 平 2, 田保红1, 贾淑果1
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作者单位：1. 河南科技大学 材料科学与工程学院, 河南 洛阳 471003; 2. 上海理工大学 机械工程学院, 上海 200093)
中文关键字：Cu-Ni-Si合金； 抗拉强度； 显微硬度； 电导率； 再结晶
英文关键字：Cu-Ni-Si alloy; tensile strength; microhardness; electrical conductivity; recrystallization
中文摘要：研究了微量合金元素Ag、P对Cu-Ni-Si合金组织和性能的影响。结果表明：微量的合金元素Ag、P的加入使Cu-Ni-Si合金出现严重的晶格畸变，起到了有效的细化晶粒的作用，同时能有效地提高Cu-Ni-Si合金的抗拉强度、电导率以及显微硬度。在450 ℃时效2 h，加入0.15%Ag使其导电率提高15.3%；加入0.03%P使其显微硬度和抗拉强度分别提高18.6%和29.8%。同时Cu-Ni-Si合金中加入微量合金元素Ag、P能明显地抑制Cu-Ni-Si合金的再结晶过程，并能细化该合金的再结晶晶粒。
英文摘要：The effects of trace Ag and P on the microstructure and properties of Cu-Ni-Si alloy were studied. The results indicate that the addition of trace Ag and P in Cu-Ni-Si alloy causes a great lattice distortion, the refining grain effect is obtained. The tensile strength, electrical conductivity and microhardness are effectively increased. With the 0.15%Ag addition, the electrical conductivity can increase 15.3% after aging at 450 ℃× 2 h. With the 0.03%P addition, the microhardness and tensile strength can increase 18.6% and 29.8% after aging at 450 ℃× 2 h, respectively. The recrystallization process is obviously controlled and the recrystallization grain is effectively refined with the addition of trace Ag and P.