镍过渡层对钛/铜软钎焊性能的影响
Effects of Ni Transitional Layer on Solderability of Ti/Cu Bonding
徐学礼， 江 轩， 何金江
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作者单位：（北京有色金属研究总院 有研亿金新材料股份有限公司，北京 102200）
中文关键字：Ti/Cu； 金属化； C-Scan； 焊接结合率； 剪切强度； 界面
英文关键字：Ti/Cu; Ni layer; C-Scan; welding bonding rate; shear strength; boundary
中文摘要：针对金属Ti、Cu之间难以直接进行钎焊的状况，采用在Ti基体上制备过渡层Ni的方法改善其可焊性，研究了不同Ni层厚度对Ti的In焊料软钎焊的影响。采用超声C扫描（C-Scan）对焊件的焊接结合率进行了分析，观察了焊缝微观组织结构及焊接断面，同时分析了焊件的结合强度。结果表明：Ni层有效提高了金属Ti的可焊性，当Ni层厚度为10 μm时可以获得最佳焊接效果。
英文摘要：Ni transitional layer was used to improve the solderability of Ti bonding with Cu. The effects of the thickness of Ni layer on the solderability of Ti with In solder were studied. The ultrasonic C-scan imaging technique was adopted to evaluate the joining quality of the weldment. The bonding rate and shear strength of the weldments were analyzed, the bonding fracture plane and welded joint microstructure were also observed. The results show that Ni layer can improve the solderability of Ti and the optimal bonding results can be obtained under Ni layer with 10 μm.