平板对接焊残余应力的三维有限元模拟与实验研究
Numerical Simulation and Experimental Research on Residual Stress of Butt-welding of Flat Plate
李新平1,2, 王荣辉2, 李泽雨2
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作者单位:(1.华南理工大学 亚热带建筑科学国家重点实验室,广东 广州 510640;2.华南理工大学 土木与交通学院,广东 广州 510640)
中文关键字:平板对接焊; 残余应力; 数值模拟; 盲孔法
英文关键字::flat plate of butt-welding; residual stress; numerical simulation; blind-hole method
中文摘要:针对平板对接焊焊接时的热应力特征,通过对焊接过程中加热与冷却温度场的正确描述,并采用合理的热源模式,应用有限元软件ANSYS对其温度场和应力场进行了耦合模拟分析。分析中考虑了钢材热物理参数和力学参数随温度变化的非线性,得到了焊后残余应力的大小与分布规律。设计了等厚和不等厚两组焊接试件,采用盲孔法对其残余应力进行了实测,实测结果与数值模拟结果吻合良好,证明了有限元数值模拟方法的正确。
英文摘要: Through the right description of temperature field in welding process during heating and cooling, using the suitable heat source model in practical production, the coupling calculation of temperature field and welding stress filed was carried out by software ANSYS. The parameters of thermo-physical performance and mechanical performance as the function of temperature were taken into consideration. The residual stress both in butt-welding specimen with equal thickness plates and unequal thickness plates were measured by blind-hole method. The experimental results are in agreement with the simulation results, which show that the numerical simulation method is correct.