高强度无银铜基钎料的制备研究
Study on Preparation of High-strength Silver-free Copper Base Solder
杨凯珍, 易振华, 刘凤美, 向 杰
点击:3297次 下载:0次
作者单位:广州有色金属研究院 焊接材料研究所,广东 广州 510650)
中文关键字:钎焊;无银铜基钎料
英文关键字:braze welding; silver-free copper base solder
中文摘要:通过实验确定了Cu-5P为无银铜基钎料的基体,在此基础上添加Sn、Ni和其他微量元素,制备了性能指标超过含Ag量(质量分数)达5%的铜基钎料的新型无银铜基钎料。
英文摘要:This article selected Cu-5P as the matrix of silver-free copper based solder by experiment,on this basis, adding Sn, Ni and other trace elements, the new type of silver -free copper based solder was prepared,and it has better performance than the copper-based solder with 5% Ag.