增强颗粒对Sn0.7Cu基复合钎料铺展性能的影响
Effect of Particle-reinforced on Spreading Property of Sn0.7Cu Based Composite Solders
杨 莉
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作者单位：徐州工程学院 机电工程学院, 江苏 徐州221008
中文关键字：增强颗粒； Sn0.7Cu；复合钎料；铺展性能
英文关键字：particle-reinforced； Sn0.7Cu； composite solder； spreading property
中文摘要：以Sn0.7Cu共晶钎料作为基体钎料，通过添加微细金属颗粒（1 ?滋m Ag、1 ?滋m Ni和8 ?滋m Cu）形成颗粒增强复合钎料。研究了增强颗粒对复合钎料铺展性能的影响，优选出Sn0.7Cu基复合钎料的最佳增强体。研究表明：Ni（3 vol% ）颗粒增强Sn0.7Cu复合钎料铺展性能差；Cu（3 vol%）颗粒增强复合钎料铺展性能不如Ag（3vol%）颗粒增强复合钎料；对于金属颗粒增强Sn0.7Cu基复合钎料，Ag颗粒为最佳增强体。
英文摘要：The particle-reinforced composite solders were prepared by adding 1 ?滋m Ag, 1 ?滋m Ni and 8 ?滋m Cu to Sn0.7Cu eutectic solder in current research. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spreading property of Ni（3 vol%）particle-reinforced Sn0.7Cu based composite solder was the worst among Sn0.7Cu based composite solders. The spreading property of the Cu particle-enhanced Sn0.7Cu based composite solder was worse than those of Ag particle-enhanced Sn0.7Cu based composite solders. So Ag particles were considered as the most appropriate reinforced particles for Sn0.7Cu based composite solders.