Sn-Ag-Cu系无铅焊料性能研究进展
Investigation Progress on Properties of Sn-Ag-Cu Lead Free Solder Paste
张莎莎， 张亦杰， 马乃恒， 王浩伟
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作者单位：上海交通大学 金属基复合材料国家重点实验室，上海 200240
中文关键字：无铅焊料；Sn-Ag-Cu；性能
英文关键字： lead-free solder; Sn-Ag-Cu; properties
中文摘要：Sn-Ag-Cu是全球公认的最具潜力替代Sn-Pb 钎料的无铅焊料。本文介绍了Sn-Ag-Cu系无铅焊料在熔化温度、润湿性、抗氧化性和焊接可靠性方面的主要性能以及最近的研究重点，最后对Sn-Ag-Cu系无铅焊料的发展趋势进行了展望。
英文摘要：Sn-Ag-Cu solder systems are one of the most promising lead-free alloys. The studying emphasis, such as melting temperature, wettability, oxidation resistance as well as soldering reliability are summarized in details. Furthermore, the prospects for development of Sn-Ag-Cu solder systems are proposed.