新型无铅焊料Sn-X-Cu-Ni的性能研究
Property of New Type Lead-free Solder Sn-X-Cu-Ni
杨 磊1 , 郭黎2 , 揭晓华1
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作者单位：（1.广东工业大学 广东 广州 510006； 2.高新锡业（惠州）有限公司, 广东 惠州 516123）
中文关键字：无铅焊料； 润湿性； 力学性能
英文关键字：lead-free solder; wettability; mechanical properties.
中文摘要：利用化学元素周期表上第VA族X元素和Ni元素代替Sn-Ag-Cu系列中的Ag制备出一种新型无铅焊料。用DSC测量了合金焊料的熔点，并考察了其润湿性和焊接接头强度，实验结果表明：Sn-X-Cu-Ni系新型合金焊料与Sn-Ag-Cu系和Sn-Cu系合金相比其润湿性和焊点剪切强度有明显的改善，焊点拉伸强度略有提高，但熔点有所升高。
英文摘要：Using periodic table of elements VA first group elements X, Ni took the place of Sn-Ag-Cu series Ag to prepare a new type of lead-free solder. The solder alloy melting point was measured with DSC, and its wettability and weld strength were investigated. The results show that compared with Sn-Ag-Cu system, and Sn-Cu system， the wettability and solder joints shear strength of Sn-X-Cu-Ni system significantly improves， slightly higher tensile strength of the solder joints, however, slightly higher melting point.