SiCP尺寸对铜基复合材料抗氧化性及磨损性的影响
Influence of SiCP Size on Oxidation Resistance and Wear Characterization of SiCP /Cu Composites
解念锁, 李春月, 艾桃桃, 蔡继峰
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作者单位：陕西理工学院 材料科学与工程学院, 陕西 汉中 723003
中文关键字：SiCP /Cu复合材料； SiCP尺寸； 抗氧化性； 耐磨性
英文关键字：SiCP/Cu composites; SiCP size; oxidation resistance; wear resistance
中文摘要：采用粉末冶金法制备了SiC粒径分别为10、20和40 μm的 SiCP /Cu复合材料，对复合材料的抗氧化性和耐磨损性进行了研究， 并对磨损形貌进行了观察。结果表明，在氧化温度为400～700 ℃时， SiCP /Cu复合材料的抗氧化性优于纯铜，粒径为20 μm的SiCP /Cu复合材料的抗氧化性最优。复合材料的磨损性能也随SiCP粒径的变化发生明显改变，在载荷≤100 N时，SiCP粒径增大有助于提高复合材料的耐磨性， 其磨损机制主要是磨粒磨损；随着载荷的增加，大粒径SiCP易于破损，复合材料磨损率剧增，其磨损机制是磨粒磨损及剥层磨损的复合作用。
英文摘要：The copper matrix composites reinforced by SiCP with the size of 10 μm, 20 μm and 40 μm were fabricated via powder metallurgy technique. The effects of particle size on the oxidation resistance and wear characterization of SiCP/Cu composites were investigated by oxidation test, wear experiment and SEM. The results indicate that the oxidation resistance of SiCP/Cu is evidently better than that of pure Cu between 400 ℃ and 700 ℃. The composites with SiCP of 20 μm possess the highest oxidation resistance. The wear characterization of SiCP/Cu composites differs obviously with the change of SiCP size. When the applied load is lower than 100 N, the SiCP with larger size is helpful to improve the wear resistance of SiCP/Cu composites, and the wear mechanism is mainly abrasive wear. When the applied load increases, SiCP with larger size is easy to mash. The mechanism is the combined action of abrasive wear and delamination wear. The wear rate is sharply enhanced.