镁合金笔记本外壳温成形过程中的温度场仿真
Simulation of Temperature Field During Warm Forming Process for Laptop Shell of Magnesium Alloy
夏玉峰1， 佟 莹2， 权国政1
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作者单位：（1. 重庆大学 材料科学与工程学院，重庆400044；2. 重庆电子工程职业学院，重庆401331）
中文关键字：温度；热力耦合；温成形；镁合金
英文关键字：temperature; thermo-mechanical coupled; warm forming; magnesium alloy
中文摘要：阐述了温成形过程中热力耦合效应的数值分析方法，建立了镁合金笔记本外壳温成形过程耦合计算的有限元模型，并采用热力耦合技术对镁合金笔记本外壳温成形过程中的温度场进行了数值模拟，研究了成形过程中温度场的分布规律，为后续工件的应力应变的研究做理论基础。同时对工件冷却时的温度场进行了分析，以此来更好的确定工件的组织和性能。
英文摘要：The numerical computation theory of thermo-mechanical coupling effect during warm forming process was expatiated. The simulation model of laptop shell of magnesium alloy warm forming process based on thermo-mechanical coupled was set up, and the numerical simulation of the temperature field was carried out. The distributions of temperature field were discussed to pravidetheoretical basis for studying stress and strain in next steps. At the same time, the work-piece temperature field in cooling process was analyzed to determine the microstructure and mechanical properties of magnesium alloy shell.