电路板复合材料高速钻削刀具的磨损
Wear of High Speed Drilling Tool Used for Printed Circuit Board Composite
汤宏群1,2, 王成勇1, 王 冰1
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作者单位：(1. 广东工业大学 机电学院, 广东 广州 510006; 2. 广西大学 有色金属及材料加工新技术教育部重点实验室, 广西 南宁 530004)
中文关键字：印刷电路板复合材料； 高速钻削； 磨损机制； 磨损形态
英文关键字：printed circuit board (PCB) composites; high speed drilling;wear mechanism; wear modality
中文摘要：讨论印刷电路板(PCB)复合材料高速钻削刀具的磨损机制，分析PCB高速钻削刀具的磨损形态，总结 PCB微钻材料的发展。 提出PCB高速微钻刀具材料选择的基本要求， 目的是延长PCB刀具寿命，提高PCB高速微钻孔质量。
英文摘要：The wear mechanism of high speed drilling tool used for printed circuit board (PCB) composites was discussed. The wear modalities of high speed drilling tool were analyzed. The development of micro-drilling materials was summarized. The basic demand of choosing material of high speed drilling tool used in PCB was put forward. The aim was to prolong the lifespan of PCB cutting tool and enhance the quality of PCB small hole drilling.