电子封装用金刚石/铝复合材料的显微组织与热膨胀性能
Microstructure and Thermal Expansion of Diamond/Al Composites Used for Electronic Packaging
冯 号, 于家康, 薛 晨, 马明辉
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作者单位：(西北工业大学 凝固技术国家重点实验室, 陕西 西安 710072)
中文关键字：镀层； 复合材料； 气压浸渗； 微观组织； 热膨胀性能
英文关键字：coating; composites; gas pressure infiltration; microstructure; thermal expansion
中文摘要：在金刚石表面镀钛改善金刚石与铝合金之间的界面结合，并用气压浸渗工艺制备镀钛金刚石颗粒增强铝基复合材料。对复合材料的显微组织进行了研究，测试了复合材料的热膨胀系数。结果表明，镀钛金刚石颗粒与铝合金基体之间界面结合良好，材料的断裂以基体断裂为主，同时存在一定量的界面断裂； 选用形貌规则的金刚石有利于提高复合材料中金刚石的体积分数，从而降低复合材料的热膨胀系数。
英文摘要：The interfacial bonding between diamond and aluminum alloy was improved by plating titanium on the surface of diamond particles. The diamond/aluminum composites with titanium coating on diamond particles were prepared by gas pressure infiltration. The microstructure and coefficients of the composites were analyzed and measured, respectively. The results show that, the interfacial bonding between diamond and aluminum alloy is strong, the matrix fracture is the dominant fracture way, and interfacial fracture also exists. Selecting regular diamond particles as reinforcement is good for increasing the volume fraction of diamond, which can decrease thermal expansion coefficient of the composites.