真空热压烧结W(50) / Cu-Al2O3复合材料的性能研究
Research on Properties of W(50)/Cu-Al2O3 Composite Prepared by Vacuum-pressed Sintering
张晓伟1, 田保红1,2, 赵瑞龙1, 刘 勇1,2
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作者单位：(1. 河南科技大学 材料科学与工程学院, 河南 洛阳 471003; 2. 河南省有色金属材料科学与加工技术重点实验室,河南 洛阳 471003)
中文关键字：热压烧结； W(50)/Cu-Al2O3； 致密度； 性能； 断裂机理
英文关键字：hot-pressed sintering; W(50)/Cu-Al2O3 composite; density; properties; fracture mechanism
中文摘要：采用真空热压烧结工艺制备W(50)/Cu-Al2O3复合材料， 观察了其显微组织， 测试了其致密度、硬度、抗弯强度和导电率。 结果表明：W(50)/Cu-Al2O3复合材料组织致密；致密度和硬度优于Cu-50%W，致密度可达99.8%，显微硬度达135 HV。而导电率为46 %IACS，略低于W-50%Cu复合材料。抗弯强度为291.3 MPa，弥散铜钨合金室温弯曲断裂主要以弥散Cu相的撕裂为主，伴随有W-Cu界面的分离和部分W晶粒的解理断裂。
英文摘要：W(50)/Cu-Al2O3 composite was successfully fabricated by vacuum hot-press sintering process. The density, hardness, bending strength and electrical conductivity were investigated. The results show that the microstructure of the composite is very dense, with the theoretical density of 99.8% and excellent comprehensive properties, such as microhardness 135 HV, electrical conductivity 46%IACS and bending strength 291.3 MPa. The density and microhardness are higher than those of W-50%Cu composite. The bending fracture surface shows brittle fracture mechanism due to the copper based binder fracture following the separation of tungsten-copper interface and the cleavage of part tungsten particle.