缓冲剂对铝合金表面化学镀Ni-P合金性能的影响
Effect of Buffer Agent on Property of Electroless Plating of Ni-P Alloy on Al Alloy Surface
陈艳芳1,2, 齐妍洁1, 马明月1, 苌清华1,2
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作者单位：(1. 河南科技大学 材料学院, 河南 洛阳 471003; 2. 河南省有色金属材料科学与加工技术重点实验室, 河南 洛阳471003)
中文关键字：铝合金； 化学镀Ni-P； 缓冲剂； 镀层
英文关键字：Al alloy; electroless nickel-phosphorus; buffer agent; plating
中文摘要：研究了镀液中缓冲剂浓度对铝合金表面化学镀的影响，利用测定镀速、扫描电镜、能谱分析和极化曲线等方法对化学镀的速度、镀层形貌、镀层成分和镀层的耐腐蚀性进行了表征。结果表明：缓冲剂采用丁二酸，其浓度为16 g/L时镀速最快，镀层均匀、致密、颗粒细小，并且镀层含P量最大，耐腐蚀性最强。
英文摘要：The influences of buffering agent concentration in electroplating on electroless plating on Al alloy surface were studied. Through measuring deposition speed, SEM, EDS and polarization curve etc, the plating speed, morphology, composition and corrosion resistance of the plating were characterized. The results show that the plating speed is soonest when using succinic acid as buffering agent and its concentration is 16 g/L. At this time, not only the plating is homogeneous, compaction and has small grain, but also phosphorus contents is maximum and the corrosion resistance is greatest.