易切削Cu-Zn-Se-Bi-Sn合金位错对流变应力影响的研究
Effect of Dislocation on Flow Stress of Free-cutting Cu-Zn-Se-Bi-Sn Alloy
张丽娜, 刘柏雄, 张迎晖, 杨 斌
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作者单位：(江西理工大学 工程研究院， 江西 赣州 341000)
中文关键字： Cu-Zn-Se-Bi-Sn合金； 热模拟； 位错
英文关键字：Cu-Zn-Se-Bi-Sn alloy; thermal simulation; dislocation
中文摘要：采用Gleeble-1500热模拟机研究了Cu-Zn-Se-Bi-Sn合金在变形温度为550～700 ℃，变形速度为0.1 s-1时的流变应力变化规律，利用TEM观察了该合金的位错结构。结果表明：Cu-Zn-Se-Bi-Sn合金高温动态再结晶明显降低了合金的流变应力，变形量在0.15～0.8时，流变应力趋于稳定；Cu-Zn-Se-Bi-Sn 合金中存在Bi2Se3相，当变形温度低于700 ℃时，因其钉扎作用造成局部位错密度高，使变形过程中的流变应力增加。
英文摘要：The hot deformation behavior of Cu-Zn-Se-Bi-Sn alloy under the temperature from 550 ℃ to 700 ℃ and the strain rate of 0.1 s-1 was studied by Gleeble-1500 thermal compression. The structure of the dislocation of the alloy was observed by TEM. The flow stress significantly decreases when the dynamic recrystallization takes place during hot deformation. The flow stress remains stable under the strain rate of 0.15 to 0.8. The dislocation density around Bi2Se3 phase increases when deforming temperature is below 700 ℃, which makes the flow stress increase during the deformation.