无铅焊接缺陷研究
Study on Defects of Lead-free Soldering
宋长发
点击：3348次 下载：0次
作者单位：（桂林电子科技大学 应用科技学院，广西 桂林 541004）
中文关键字： 无铅钎焊； 钎焊点缺陷
英文关键字：lead-free soldering； soldering jont defect
中文摘要：针对电子组装过程中无铅钎焊工艺在实际生产中出现的缺陷进行了分析研究，找出导致焊点表面粗糙、焊锡珠、漏焊、空洞、钎焊点合金层退变等钎焊缺陷的原因，通过反复试验，提出解决问题的方法，经生产实践证明，这些方法行之有效。
英文摘要：The defects of lead-free soldering process in actual production were discussed, the reasons for soldering joint defects, such as, rough appearance of solder joints, soldering balls, solder skips, voids, degeneration of intermetallic compounds, etc. were found out. The measurements for above defects were proposed by repeated experiments. It is proved that the measurements are effective and have certain guiding significances for solving problems appearing in actual production.