回流焊缺陷成因及其解决对策的研究
Study on Causes and Solutions of Defects During Reflow Soldering
彭 勇， 王万刚， 刘 新
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作者单位：（重庆城市管理职业学院 信息工程学院，重庆 401331）
中文关键字：回流焊； 表面贴装技术； 焊接缺陷
英文关键字：reflow soldering; surface mount technology(SMT); soldering defects
中文摘要： 为了保证表面贴装电子产品的质量，对表面贴装工艺的核心环节回流焊的工艺特点进行了分析，讨论了回流焊的温度曲线特点和影响回流焊焊接质量的几个主要因素，并根据回流焊的温度和工艺特点对回流焊焊接过程中出现的立片、桥连、芯吸、空洞、锡球、PCB扭曲、IC引脚焊后开路等几种常见的焊接缺陷及其成因进行了分析，提出了相应的解决对策。通过这些措施，有效的降低了焊接缺陷的出现率，提高了回流焊的焊接质量。
英文摘要： In order to ensure the quality of surface-mount electronic products, the temperature characteristics of reflow soldering, which is the key process of surface mount technology, were analyzed and the characteristics of the reflow profile and the major factors which affect the quality of the reflow soldering were discussed. According to the characteristics of reflow temperature and technology, the causes and phenomenon of common defects occured in reflow soldering, such as, wicking, bridging, voiding, solder balling， PCB distortion and opening of IC pin were analyzed and some effective solution methods were put forward．These measures can effectively reduce the occurrence rate of the welding defects and improve the welding quality of the reflow soldering.