钨 / 铜第一壁复合材料界面行为研究
Investigation on Interface Characteristic of W / Cu Plasma Facing Component
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作者单位:(徐州工程学院 数学与物理科学学院, 江苏 徐州 221008)
中文关键字:钨; 第一壁材料; 界面行为
英文关键字:tungsten; plasma facing component; interface characteristic
中文摘要:通过等离子喷涂技术在铜合金基体上制备具有不同适配层的钨涂层第一壁复合材料,并对其界面行为进行研究。结果表明, W / Cu、NiCrAl和Ti适配层均能明显降低W / Cu界面热应力,但其界面仍是第一壁复合材料最可能失效的位置;W / Cu适配层能有效提高此复合材料界面的结合强度,增幅高达30%。
英文摘要:Tungsten coating was fabricated on copper alloy by plasma spraying and its interface characteristic was investigated. The results show that the compliant layers (W / Cu, NiCrAl and Ti) are helpful to reduce W / Cu interface thermal stress, but the most possibility failure position of W / Cu plasma facing component is still in the interface. W / Cu adaptation layer can effectively enhance the bonding strength between tungsten coating and copper substrate by 30%.