易切削Cu-Zn-Se-Bi-Sn合金动态再结晶机制与位错组态
Dynamic Recrystallization Mechanism and Dislocation Configuration of Free-cutting Cu-Zn-Se-Bi-Sn Alloy
刘柏雄1, 张丽娜2
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作者单位：(1. 江西理工大学 工程研究院, 江西 赣州 341000; 2. 江西理工大学 应用科学学院, 江西 赣州 341000)
中文关键字：Cu-Zn-Se-Bi-Sn合金； 热变形； 动态再结晶； 位错组态
英文关键字：Cu-Zn-Se-Bi-Sn alloy; hot deformation; dynamic recrystallization; dislocation configuration
中文摘要：采用H800透射电镜观察了不同变形量条件下Cu-Zn-Se-Bi-Sn合金的热变形组织。研究发现，在不同变形量的Cu-Zn-Se-Bi-Sn合金中分别出现了位错网、位错墙及位错胞三种位错组态。当变形量为2%时，在Cu-Zn-Se-Bi-Sn合金晶粒内部某些区域形成明显的位错网；变形量达到20%时，位错开始在原始晶界附近规整化排列，并在一些区域内排列成整齐的位错墙，同时出现亚晶界的离解与亚晶间聚合； 当变形量达到80%时，出现了明显的动态再结晶亚晶聚合形核。
英文摘要：The hot-deformed microstructure of Cu-Zn-Se-Bi-Sn alloy with different deformation degree was observed by H800 TEM. The research shows that three different dislocation configurations such as dislocation network, dislocation wall and dislocation cell appear in Cu-Zn-Se-Bi-Sn alloy with different deformation strain. The dislocation network appears in some certain grains of Cu-Zn-Se-Bi-Sn alloy deformed with strain of 2%; when the deformation strain is up to 20%, the dislocation initially arranges regularly beside original grain boundaries and the arranged dislocation wall appears in some area, and the merging of sub-grains appears. The obvious dynamic recrystallization nucleation by sub-grain merging of Cu-Zn-Se-Bi-Sn alloy appears when the deformation strain is 80%.