电子封装材料的研究现状及发展
Research Status and Progress of Electronic Packaging Materials
方 明, 王爱琴, 谢敬佩, 王文焱
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作者单位：(河南科技大学 材料学院, 河南 洛阳 471003)
中文关键字：电子封装材料； 金属基复合材料
英文关键字：electronic packaging material; metal matrix composite
中文摘要：根据电子封装材料的特点及要求，介绍了几种封装材料，详细地阐述了金属基复合封装材料的性能特点、制备方法、应用背景及存在的问题。并展望了电子封装材料的发展前景。
英文摘要：Several packaging materials were introduced according to the characteristics and requirements of electronic packaging material. The performance characteristics, preparation methods, application background and the existing problems of metal matrix composite were discussed in details. The prospects for the further development of electronic packaging materials were given.