
ZrB2陶瓷与Al-Sn-Mg合金扩散焊研究
Study on Diffusion Bonding of ZrB2 Ceramic and Al-Sn-Mg Alloy
潘厚宏1, 2, 饭岛惠吾2, 刘拥军1, 伊藤勲2
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作者单位:(1.西南交通大学 材料科学与工程学院,四川 成都 610031; 2.群马大学 工学部,日本 群马 桐生 376-8515)
中文关键字:扩散焊接; ZrB2陶瓷; Al-Sn-Mg合金; 剪切强度
英文关键字: diffusion bonding; ZrB2 ceramic; Al-Sn-Mg alloys; shear strength
中文摘要:在大气环境下,采用扩散焊接方法进行了ZrB2陶瓷与Al-Sn-Mg合金的连接。Al-Sn-Mg合金为Al-x%Sn-y%Mg (x=0, 0.5, 1.0, 2.0; y=0, 0.5, 1.0, 2.0),ZrB2陶瓷为纯ZrB2型。焊接工艺是在1、2 和4 MPa的压力,873 K的温度下保持3.6、7.2和14.4 ks。采用扫描电镜、电子探针及剪切试验等测试方法研究了其接头的组织及力学性能。结果表明,ZrB2陶瓷能够与Al-Sn-Mg合金实现扩散连接。“Al-Sn”合金可作为ZrB2陶瓷扩散焊中间层材料使用,最合适的合金为Al-0.5Sn-0.5Mg。ZrB2/Al-0.5Sn-0.5Mg在873 K温度下进行扩散焊,焊接压力在2~4 MPa,保温时间在7.2~14.4 ks时获得的接头强度都在42~44 MPa之间,但该接合强度只能保持到373 K,不适合在高温环境下使用。
英文摘要: ZrB2 ceramic and Al-Sn-Mg alloys were bonded by diffusion welding at atmosphere. Al-Sn-Mg alloys were Al-x%Sn-y%Mg (x=0, 0.5, 1.0, 2.0; y=0, 0.5, 1.0, 2.0). ZrB2 ceramic was fine ZrB2 type. The welding process is at 873 K for 3.6ks, 7.2 ks and 14.4 ks under the pressure of 1MPa, 2MPa and 4MPa. The microstructure of bonding interface and shear fracture surface was investigated by SEM and EPMA. The results show that ZrB2 ceramic can be joined to Al-Sn-Mg alloy with diffusion bonding. "Al-Sn" alloy can be used as an interlayer for diffusion bonding of ZrB2 ceramic. And the optimum “Al-Sn” alloy is Al-0.5Sn-0.5Mg. The shear strength of ZrB2/Al-0.5Sn-0.5Mg joint, which is bonded at 873 K for 7.2 ks, 14.4 ks under 2~4 MPa, is 42~44 MPa, but it can only keep to 373 K.