SiC颗粒增强铜基复合材料热残余应力的数值模拟
Numerical Simulation of Thermal Residual Stress in Copper Matrix Composite Reinforced by SiC Particle
强 华
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作者单位：(西南大学 育才学院, 重庆 400715)
中文关键字：SiC颗粒； Cu基复合材料； 数值模拟； 热残余应力
英文关键字：SiC particle; copper matrix composite; numerical simulation; thermal residual stress
中文摘要：利用有限元方法建立轴对称模型分析了SiC颗粒尺寸、体积分数以及温度对铜基复合材料热残余应力的影响。结果表明，随温度的升高，残余应力很快增大；随SiC颗粒尺寸和体积分数的增大，残余应力均呈增大趋势。基体受残余拉应力，颗粒受残余压应力，在结合界面处存在最大残余拉应力。
英文摘要：A axisymmetric finite element mode(FEM) was used to analyze the effect of particle with different size, different volume fraction and different temperature on the mechanical properties of SiC particle reinforced copper-matrix composite. The results show that the residual stress increases quickly with increasing the temperature. The residual stress increases with increasing the size and volume fraction of particle. There are tensile stress on the matrix, compress stress on the particle and maximal stress near the interface.