铜基电镀Ni-P合金热处理性能的研究
Properties of Ni-P Alloy Deposited by Electro-plating on Copper After Heat Treatment
杨 杰, 赵祖欣, 张修庆, 尚淑珍
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作者单位：(华东理工大学 机械与动力工程学院 承压系统安全科学教育部重点实验室, 上海 200237)
中文关键字：结晶器；Ni-P合金； 耐磨性； 热处理； 硬度
英文关键字：crystallizer; Ni-P alloy; wear resistance; heat treatment; hardness
中文摘要：研究了热处理温度对铜基电镀Ni-P合金镀层硬度和耐磨性的影响，并对各镀层的组织、表面形貌与磨痕进行了观察,对镀层的性能进行了测试。结果表明：随热处理温度升高，镀层中生长出沿电流线方向的柱状晶，400 ℃热处理时，柱状晶组织均匀致密；随热处理温度升高，硬度与耐磨性呈现先增大后减小的趋势，且变化规律基本一致。
英文摘要：The influences of heat treatment temperature on hardness and wear resistance of Ni-P alloy deposit were studied. The microstructure, surface micrograph and the grinding defect of coating were observed. The mechanical properties of the coating were measured. The results show that the columnar crystal grows from the coating in the direction of current line with the increase of heat treatment temperature. When the heat-treatment temperature reaches 400 ℃, the columnar crystal's structure is homogeneous and compact. The hardness and wear resistance first increase and then decrease with the increase of heat treatment temperature. And the varying regularities are basically consistent.