膨胀压差法扩散连接残余应力数值模拟
Numerical Simulation on Residual Stress in Diffusion Bonding Joints by Difference of Expansion Stress
宋敏霞1, 赵 贺2, 胡贤飞1
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作者单位:(1.海擎重工机械有限公司,辽宁 葫芦岛 125000;2.太原科技大学 材料学院,山西 太原 030024)
中文关键字:膨胀压差; 扩散连接; 残余应力; 数值模拟
英文关键字: difference of linear expansion; diffusion bonding; residual stress; numerical simulation
中文摘要:采用有限元分析软件ANSYS对Ti-6Al-4V与ZQSn10-10组合筒形件扩散连接接头残余应力的大小及分布进行了数值模拟。结果表明,有害的较大的残余应力出现在连接界面金属间化合物混合层上以及靠近Ti-6Al-4V母材侧的狭小区域;沿着连接界面轴向上的应力分布均匀,但邻近上下表面由于边缘效应而产生较大的应力集中。
英文摘要: The residual stress in the diffusion bonding joints of Ti-6Al-4V and ZQSn10-10 sleeve structure was simulated by ANSYS. The results indicat that the residual stress which is harmful to the joint, appears in the narrow area adjacent to Ti-6Al-4V side where intermetallic compounds form; and the stress uniformly distributes along the welding axis. But the stress concentrates on the upper and down surfaces, because of brinkmanship.