Abstract: The effects of heat treatment on the microstructure and properties of Al-Mg-Si-Cu aluminum alloy were studied by scanning electron microscope, optical microscope, tensile testing machine and conductivity meter. The results show that the strength, hardness and conductivity of the alloy increase first and then decrease with the increase of solution temperature and aging temperature and the extension of holding time. After solid solution at 530 ℃ for 30 min, the alloy is recrystallized to obtain fine equiaxed grains. After aging at 175 ℃ for 10 h, the alloy obtains relatively high mechanical properties, with tensile strength of 390 MPa, hardness of 120 HV, conductivity of 41.5%IACS, its fracture mode is ductile fracture. The better solid solution process of the alloy is 530℃/30min, and the better artificial aging process is 175 ℃/12 h,which can meet the requirements of mechanical properties and conductivity of aluminum alloy in electronic products.