钨粉粒度对W-10Cu复合材料组织和性能的影响

    Effect of Tungsten Powder Particle Size on Microstructure and Properties of W-10Cu Composite

    • 摘要: 为研究不同钨粉粒度对W-10Cu复合材料性能影响,分别选用费氏粒度为1.0、1.6 以及2.1 μm的钨粉制备W-10Cu复合材料,并对其组织、密度、硬度、电导率以及热扩散系数进行测试。研究表明:随着钨粉粒度的增大,W-10Cu复合材料的组织均匀性逐渐提升,组织内闭孔数量逐渐减少,W-10Cu复合材料的密度和硬度呈下降趋势,W-10Cu复合材料的电导率和热扩散系数呈增大趋势。

       

      Abstract: In order to study the effect of different tungsten powder particle size on the properties of W-10Cu composites, tungsten powders with particle size of 1.0 μm, 1.6 μm and 2.1 μm were selected to prepare W-10Cu composites, and its microstructure, density, hardness, electrical conductivity and thermal diffusion coefficient were tested. The results show that with the increase of tungsten powder particle size, the microstructure uniformity of W-10Cu composite is gradually improved, the number of closed pores in the microstructure gradually reduces, the density and hardness of W-10Cu composites decrease, and the electrical conductivity and thermal diffusion coefficient of W-10Cu composite increase.

       

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