Study on Regularity of Effect of Electrolyte Plasma Polishing Process Parameters on Envelope Gas Layer

In order to confirm the influence of processing voltage and processing temperature of electrolyte plasma polishing(EPP) on the vapour gaseous envelope(VGE) of stainless steel polishing, a combination of simulation and experiment was used to analyze the evolution of the envelope formation, fluctuation and stabilization at different stages, and the influence of VGE behavioral characteristics on the surface morphology of austenitic stainless steel was investigated. The simulation shows that the VGE in localized boiling mode is beneficial to the polishing effect. The optimal voltage parameter for polishing exists between 300 V and 350 V, and the optimal temperature parameter for polishing exists between 70 ℃ and 80 ℃ of electrolyte temperature. A one-way experiment was used to study the effects of voltage and initial electrolyte temperature on the surface roughness of the polished surface. The results show that the surface roughness of the workpiece reduces from 0.3 μm to 0.0546 μm at 320 V, and from 0.3 μm to 0.0513 μm at 80 ℃